Applications
Applications
Use the application direction as a starting point. Review related products and prepare the material, pulse, and system-integration details for a focused discussion.
Explore by application
View products by application direction
5G antenna finishing
Biofluorescence detection and single-photon generation
Biomedical applications
Biomedical imaging
Biomedical imaging and optical coherence tomography
Biomedical imaging and THz frequency combs
Biophotonics and chip fabrication
Cellular microsurgical ablation
Chip fine processing
Chip processing and photonic-chip fabrication
Cover-film cutting and other semiconductor industrial processing
Direct writing of optical waveguides, grating writing, and material modification
External-cavity frequency doubling of ultrashort-pulse fiber lasers in the 1 μm band
External-cavity frequency doubling of ultrashort-pulse solid-state lasers in the 1 μm band
Femtosecond laser chirped-pulse amplification
Fiber amplifier and solid-state laser seed source
Fiber and solid-state amplifier seed source
Fiber-solid hybrid amplifier seed source
Fiber–solid hybrid amplification and chip fabrication
Film opening on photovoltaic silicon wafers
Filter cutting
Industrial applications and scientific research
Industrial processing
Infrared single-photon detection and molecular precision spectroscopy
Infrared ultrashort-pulse generation and infrared spectral imaging
ITO etching
Laser ranging
Laser spectroscopy, biophotonic imaging, and strong-field THz measurement and control
LiDAR ranging and imaging
Low-K grooving
Metal coloration
Metrology
Micro- and nano-scale processing and ultra-hard-material processing
Micro/nanofabrication and nonlinear spectral imaging
Micro/nanofabrication and OLED cutting
Micro/nanofabrication and semiconductor processing
Microfluidic chip fabrication
Molecular precision spectroscopy and laser frequency stabilization
Multiphoton excitation, micro/nanofabrication, and industrial lasers
Nonlinear spectral imaging
Nonlinear spectral imaging and THz spectral imaging
OLED cutting
OLED screen repair and two-photon micro/nanofabrication
Optical coherence tomography
Photonic chip fabrication
Precision drilling, scribing, cutting, and surface treatment
Precision marking
Precision measurement and laser communications
Precision measurement and optical atomic clocks
Precision metrology
Precision micro/nanofabrication
Precision micro/nanofabrication and cellular microsurgery
Pulse time-domain control
Quantum-secure communications, laser communications, and OCT
Raman scattering imaging and nonlinear frequency conversion
Research
Second-, third-, and fourth-harmonic generation for ultrafast lasers
Seed source for fiber–solid-state laser amplification, ultrafast dynamics detection, and ultrafast spectroscopy
Semiconductor and photonic-chip fabrication
Single-shot ultrafast measurement
Surface modulation
Surface modulation and structural coloration
Surface quantum control and nonlinear optics
System integration applications
THz spectral imaging
THz time-domain spectroscopy
Time-frequency transfer, laser communications, and ultrafast dynamics measurement and control
Two-photon fluorescence imaging and pump-probe measurements
Two-photon imaging
Two-photon micro/nanofabrication
Two-photon polymerization and two-photon fluorescence excitation
Two-photon polymerization processing of microstructures
Ultrafast dynamics measurement
Ultrafast laser amplification with fiber amplifiers and other amplifiers
Ultrafast laser amplification with solid-state amplifiers and other amplifiers
Ultrafast laser stealth dicing
Ultrafast spectroscopy
Ultrafast spectroscopy and ultrafast dynamics detection
Ultrafast spectroscopy detection, infrared and THz spectroscopy
Ultrafast spectroscopy, precision metrology, and laser ranging
Various precision processing applications
Various processing applications
Wafer dicing and chip Low-K grooving
Wafer dicing, optoelectronic display panel repair, and crystal etching
Prepare for an inquiry
Prepare three areas before calling
An application name alone does not define the material or system requirements. These details help focus the discussion on the sample, pulse conditions, and integration boundaries.
- 01
Materials and goals
Describe the material, sample form, and intended result. For processing tasks, include relevant dimensions, edge requirements, and surface condition.
- 02
Pulse requirements
Share pulse-energy, pulse-width, and repetition-rate requirements, along with operating conditions such as throughput or scanning speed when available.
- 03
Integration conditions
Describe the existing optical path, focusing conditions, trigger timing and interfaces, cooling, available space, and operating schedule.
Call to Discuss
Start with the application and discuss a suitable light-source direction
With your materials, goals, and system conditions ready, call us to discuss the requirements.